2D and 3D Laser Image Processing
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2D and 3D Laser Image Processing


This particular type of laser provides a telecentric laser line with a constant line length and width for your working range. Therefore it is intended for high-precision surface inspections e.g. the smallest structures on electronic circuit boards.

The Line Laser Profiling System (LLPS) is a complete solution for analyzing line lasers up to 200 mm in length and down to 55 μm in width.

Osela's StreamLine laser offers an unrivaled range of options for the highest demands on line width, specific wavelengths and maximum depth of focus. The latter are particularly important with increasingly varying material heights in triangulation measurements.

Osela's CompactLine laser offers a wide range of options for the highest requirements in terms of line width, specific wavelengths and maximum depth of focus. The laser is also extremely compact and very versatile.

OTM-Smilodon-10G-EVO-xxx

SMILODON EVO Series - Industrial camera for Machine Vision Applications, equipped with onboard image preprocessing based on FPGA / Zynq technology, ideal for 3D laser triangulation, CMOS sensors with resolution from 5 to 25 MP.

T-REX EVO Series - Industrial camera for Machine Vision Applications, equipped with onboard image preprocessing based on FPGA / Zynq technology, ideal for 3D laser triangulation, CMOS sensors with resolution of 2.2 or 4.2 MP, in  monochrome, color or NIR enhanced.