JDSU Solid-State Pulsed laser

Description

JDSU pulsed DPSS lasers cover two regimes: high power UV (355 nm) and green (532 nm) Q-switched for micromachining applications and low-power UV (355 nm) mode-locked serving biotech, inspection, and micro-stereolithography applications.
This is made possible by the three different product groups that together cover these markets:
The JDSU Q Series lasers are Q-switched diode-pumped UV and green lasers which are used for high-pulse-energy processing of materials such as ceramics, high-repetition-rate processing of materials such as sapphire or silicon, or patterning thin-film solar cells. In all of these applications, the Q Series lasers deliver unsurpassed performance combined with industry-leading uptime.
Due to the self-stabilizing characteristics of intracavity UV harmonic generation, all Q Series lasers exhibit inherently high energy, high pulse-to-pulse stability and long-term output power stability. In addition, the excellent thermal management of the unique Nd:YAG-based direct-coupled pump (DCP) architecture achieves excellent beam quality over a wide range of operating conditions and maintains exceptionally stable beam position and profile, which is important for processes requiring accurate feature placement. These advantages enable Q series lasers to achieve the tightest possible process tolerances for micromachining and other materials-processing applications.

The high-power Q305 laser is an expansion of the existing Q-series that provides a solution for demanding applications requiring faster throughput.

Key Features

• Highest commercially available pulse energy and peak power
• Tighter process control due to superior energy stability enabled by unique intracavity harmonic generation
• Capable of processing the widest range of materials due to large selection of pulse energies, pulse widths, and repetition rates
• High reliability due to low fluence in harmonic crystals and no cavity optic coatings exposed to UV
• 355 and 532 nm outputs available
• Higher throughput enabled by more than 22 W of UV output power
• Customization available upon request

Applications

• Wafer scribing
• Full-cut wafer dicing
• Low-k dielectric grooving
• Micromachining of silicon, sapphire, ceramic, and metal
• Micro-via drilling
• PCB and flexboard cutting